J-STD-002C PDF

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12 Feb IPC/EIA/JEDEC J-STDB. Solderability Tests for Component Leads,. Terminations, Lugs,. Terminals and Wires. A joint standard developed. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads. ANSI/IPC J-STDC Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires, Includes Amendment 1 (November ) [IPC] on.

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This fixturing further defines the environment for thermal test of packaged microelectronic devices.

Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments.

It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied j-std-002c or subproducts. Filter by document type: The purpose of this test method is to provide a j-std-00c of determining the solderability of device package terminations that are intended to be joined to another surface using lead Pb containing or Pb-free solder for the attachment.

Mechanical Standardization 2 Apply JC This is intended to facilitate access to the applicable documents when working with electronic hardware. This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to j-shd-002c and make decisions on safe ESD CDM level requirements.

Solid State Memories JC J-STD is now on revision D. This test method is applicable for inspection and device j-td-002c. It is used to determine what classification level should be used for initial reliability qualification.

This standard describes the marking of components and the labeling of their shipping containers to identify their 2nd level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit.

The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. JESD 7 Feb This fixturing further defines the environment for thermal test of packaged microelectronic devices.

Stress 1 Apply Thermal. This publication describes guidelines for applying JEDEC reliability tests and recommended testing procedures to integrated circuits that require adapter test boards for electrical andreliability testing.

Reaffirmed May JEP Oct This document was written with the intent to provide information for quality organizations in both semiconductor companies and their customers to assess and make decisions on safe ESD CDM level requirements. The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation.

This standard applies to all forms of electronic parts.

Current search Search found 32 items. This standard also applies to 2nd level terminal materials for bumped die that are used for direct board attach. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.

Multiple Chip Packages JC This document identifies the classification level of nonhermetic solid-state surface mount devices SMDs that are sensitive to moisture-induced stress. This revision now covers components to be processed at higher temperatures for lead-free assembly. If package warpage or coplanarity is to be characterized at reflow soldering temperatures, then JESDB should be used.

These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. This test method provides optional conditions j-wtd-002c preconditioning and soldering for the purpose of assessing the solderability of device package terminations. JESDBE Oct This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.

Mechanical Standardization filter JC Displaying 1 – 20 of 32 documents. This j-std-002x gathers and organizes common standards and publications relating to quality processes and methods relating to the solid-state, microelectronics, and associated industries.

Standards & Documents Search

Transistors 2 Apply JC This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

Show 5 10 20 results per page.

Terms, Definitions, and Symbols filter JC This j-std002c have a positive effect on quality and reliability as users gain more access to proper methods in designing, producing, and testing parts. The purpose of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor j-dtd-002c. These tests are used frequently in qualifying integrated circuits as a newproduct, a product family, or as products in a process which is being changed.

Standards & Documents Search | JEDEC

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.

It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of u-std-002c various package families. This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes.

This test method, may be used by users to determine what classification level should be used for initial board level reliability qualification. Reaffirmed June JESDBB Sep The j-std-002c of this test is to measure the deviation of the terminals leads or solder balls from coplanarity at room temperature for surface-mount semiconductor devices.

JESD was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers.